
Electrolytic Dendritic Copper Powder
Dendritic copper powder produced by electrolytic deposition. Available in five grades (STD, SFP2, SFP3, SFP8, SFP10) spanning low to high apparent density. High compressibility, high green strength, non-flowing.
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Certified
Medal
Supplied
Available Grades
Standard grades held in UK stock; other grades and particle sizes made to order.
| Description | Composition (%) | App. Density (g/cc) | Size (µm) |
|---|---|---|---|
| Dendritic Copper Powder -100# STD | Cu 99.0 min | 2.6–2.7 | < 150 |
| Dendritic Copper Powder -300# SFP2 * | Cu 99.0 min | 1.95–2.20 | < 53 |
| Dendritic Copper Powder -300# SFP3 | Cu 99.0 min | 1.3–1.7 | < 53 |
| Dendritic Copper Powder -240# SFP8 | Cu 99.0 min | 0.95–1.10 | < 63 |
| Dendritic Copper Powder -300# SFP10 | Cu 99.0 min | 0.65–0.90 | < 53 |
* Made to order · Stock item unless noted · Pricing is commodity-linked — contact us for a current quotation.
CU-ED
Technical Data
CU-ED is Ronald Britton's electrolytic dendritic copper powder, available in five grades (STD, SFP2, SFP3, SFP8, SFP10) with apparent densities from 0.65 to 2.7 g/cc and copper purity of Cu 99.0% minimum. Dendritic particle morphology provides excellent compressibility and green strength for pressed diamond tool segments, powder metallurgy components, and sintered metal parts. Non-flowing. UK stock, 48-hour dispatch. ISO 9001 and ISO 14001 certified.

| Property | Value |
|---|---|
| SKU Code | CU-ED |
| Material | Copper (Cu) |
| Production Method | Electrolytic deposition |
| Particle Morphology | Dendritic |
| Available Grades | STD, SFP2, SFP3, SFP8, SFP10 |
| Purity | Cu 99.0% min |
| Apparent Density | 0.65–2.7 g/cc |
| Flow Rate (Hall) | Non-flowing |
| Compressibility | Excellent |
| Green Strength | High |
| Colour | Salmon pink / rose |
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Traceability
Verified
Mesh ↔ Micron Converter
Instantly convert between standard mesh sizes and micron measurements.
Quick tip: the minus sign in mesh sizes (e.g. -200) means the powder passes through that sieve, so -200 mesh means every particle is smaller than 75 µm.
Read the full guide →CU-ED range: STD (-100#), SFP2/SFP3 (-300#), SFP8 (-240#), SFP10 (-300#)
Where
CU-ED
Performs Best
Typical applications for this grade. Our technical team can advise on the best grade for your process.
- Diamond tool bond matrices (saw blades, drill bits, grinding wheels)
- Powder metallurgy pressed parts
- Friction materials
- Conductive pastes and coatings
- Chemical and catalytic applications